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35g BGA Syringe Tin Solder Paste Leaded Sn63pb37 Melting Point 183 °C
New technical support, the unique chemical formula provides excellent wetting to ensure high reliability. Adapted to the mobile phone repair industry, the computer digital service industry and high-precision SMT / BGA soldering processes for soldering printed circuit boards. High-end quality, unique formula, perfect performance, easy to weld, solder joint is bright and full, no weld, false welding phenomenon.
All welders needs it.
Credit to smrt_id(TK)
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